Devices and methods for analyzing granular samples

ABSTRACT

In some aspects, a device for apportioning granular samples includes a sample feeder defining a conduit, the conduit including a first opening to receive the granular samples and a second opening. The device includes a shuttle operably coupled to the sample feeder to receive the granular samples from the conduit via the second opening. The shuttle is configured to apportion the granular samples to incrementally enter a sample chamber to be analyzed. The device includes an outlet conduit fluidly coupled to the sample chamber and configured to permit the sample chamber to be evacuated.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. application Ser. No.14/744,778, filed on Jun. 19, 2015, which claims the benefit under 35U.S.C. 119(e) of U.S. Provisional Application No. 62/108,003, filed Jan.26, 2015, each of which is incorporated by reference in their entirety.

BACKGROUND

The present disclosure generally relates to systems, devices and methodsfor analyzing and processing samples. Information about the samples maybe obtained through a variety of analysis techniques such as microscopy,spectroscopy, spectrometry, chromatography, as well as many others.Information about the samples may be used to conduct experiments;improve, control or monitor production processes; or improve, control ormonitor manufactured products.

The claimed subject matter is not limited to embodiments that solve anydisadvantages or that operate only in environments such as thosedescribed above. This background is only provided to illustrate examplesof where the present disclosure may be utilized.

SUMMARY

The present disclosure generally relates to systems, devices and methodsfor analyzing and processing samples. Information about the samples maybe obtained through a variety of analysis techniques such as microscopy,spectroscopy, spectrometry, chromatography, as well as many others.Information about the samples may be used to conduct experiments;improve, control or monitor production processes; or improve, control ormonitor manufactured products.

In an example embodiment, a device for apportioning granular samplesincludes a sample feeder defining a conduit, the conduit including afirst opening to receive the granular samples and a second opening. Thedevice includes a shuttle operably coupled to the sample feeder toreceive the granular samples from the conduit via the second opening.The shuttle is configured to apportion the granular samples toincrementally enter a sample chamber to be analyzed. The device includesan outlet conduit fluidly coupled to the sample chamber and configuredto permit the sample chamber to be evacuated.

In another example embodiment, an evacuation subassembly is configuredto separate portions of granular samples based on at least onecharacteristic of a component of the granular sample portions. Theevacuation subassembly includes one or more vacuum elements configuredto generate a pressure differential to evacuate a sample chamber fluidlycoupled to the vacuum element. The evacuation subassembly includes aswitch configured to selectively couple the one or more vacuums to oneor more outlet channels to selectively evacuate the sample chamber intoone or more outlet channels. The evacuation subassembly includes atleast one receptacle fluidly coupled to the one or more outlet channelsand configured to receive substances selectively evacuated from thesample chamber. The evacuation subassembly may be configured such thateach of the granular sample portions positioned inside of the samplechamber is analyzed and selectively evacuated based on at least onecharacteristic of a component of each of the granular sample portions.

In further implementations, a method of analyzing granular samplesincludes providing granular samples to be analyzed. The method includesapportioning the granular samples into granular sample increments. Themethod includes incrementally analyzing each of the granular sampleincrements. The method includes actuating a shuttle to permit thegranular sample increment to enter a sample chamber at least partiallydefined by an electromagnetically transmissive window. The methodincludes transmitting electromagnetic radiation from an emitter toincident the granular sample increment. The method includes moving aportion of an analyzation subassembly in one or more directions ofmovement with respect to the granular sample increment to scan at leasta portion of the granular sample increment. The method includesreceiving electromagnetic radiation from the granular sample incrementby the analyzation subassembly through the window. The method includesidentifying at least one characteristic of a component of the granularsample increment based on the electromagnetic radiation received fromthe granular sample increment. The method includes evacuating thegranular sample increment from the sample chamber.

This Summary introduces a selection of concepts in a simplified formthat are further described below in the Detailed Description. ThisSummary is not intended to identify key features or essentialcharacteristics of the claimed subject matter, nor is it intended to beused as an aid in determining the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a non-limiting embodiment of a systemconfigured to analyze or process samples.

FIGS. 2A-2B are perspective views of a non-limiting embodiment of asystem configured to analyze or process samples.

FIGS. 2C-2E are perspective views of a portion of the system of FIG. 2A.

FIGS. 3A-3D are perspective views of a head assembly of the system ofFIGS. 2A-2B.

FIGS. 3E-3F are perspective views of a portion of the head assembly ofFIGS. 3A-3D.

FIGS. 4A-4B are perspective views of an interface assembly of the systemof FIGS. 2A-2B.

FIGS. 5A-5B are perspective views of a portion of the interface assemblyof FIGS. 4A-4B.

FIG. 5C is a cross-sectional view of the interface assembly of FIGS.4A-4B.

FIG. 6A is a perspective view of a non-limiting embodiment of the systemof FIGS. 2A-2B with a device configured to analyze one or more samplespositioned in a sample tray.

FIG. 6B is a perspective view of a non-limiting embodiment of the systemof FIGS. 2A-2B with a device configured to analyze layers of samples.

FIG. 6C is a perspective view of a non-limiting embodiment of the systemof FIGS. 2A-2B with a device configured to analyze granular samples.

FIGS. 7A-7B are perspective views of the non-limiting embodiment of thedevice configured to analyze granular samples of FIG. 6C.

FIGS. 7C-7D are perspective views of a portion of the device of FIGS.7A-7B.

FIG. 7E is a top view of a portion of the device of FIGS. 7A-7B.

FIG. 7F is a cross-sectional view of the device taken along view line7F-7F of FIG. 7A.

FIGS. 7G and 7H are cross sectional views of the device taken along viewline 7GH-7GH of FIG. 7A.

FIGS. 8A and 8B illustrate example configurations of a method.

FIG. 9A is a schematic diagram of the device of FIGS. 7A-7B with anevacuation subassembly.

FIGS. 9B-9D are representations of data obtained during analysis of asample by the system of FIGS. 2A-2B.

FIGS. 10A and 10B illustrate example configurations of a method.

FIGS. 11A-11D are representations of scanning methods of the system ofFIGS. 2A-2B.

FIG. 12 illustrates an example configuration of a method.

DETAILED DESCRIPTION

Reference will be made to the drawings and specific language will beused to describe various aspects of the disclosure. Using the drawingsand description in this manner should not be construed as limiting thescope of the disclosure. Additional aspects may be apparent in light ofthe disclosure, including the claims, or may be learned by practice. Thedrawings are non-limiting, diagrammatic, and schematic representationsof example embodiments, and are not necessarily drawn to scale.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used to enablea clear and consistent understanding of the disclosure. It is to beunderstood that the singular forms “a,” “an,” and “the” include pluralreferents unless the context clearly dictates otherwise. Thus, forexample, reference to “a component surface” includes reference to one ormore of such surfaces.

By the term “substantially” it is meant that the recited characteristic,parameter, or value need not be achieved exactly, but that deviations orvariations, including for example, tolerances, measurement error,measurement accuracy limitations and other factors known to thoseskilled in the art, may occur in amounts that do not preclude the effectthe characteristic was intended to provide.

The term “granular sample” may include single crystalline particles,polycrystalline particles, granulated particles, granulatedmulticomponent particles, micronized particles, single component orblended substances, or any combination thereof. In some aspects,“granular sample” may include any powdered sample.

The term “vacuum” may refer to a pressure differential in a system or aportion of a system. The term “vacuum” may include a positive ornegative pressure differential. In some aspects, the term “vacuum” mayrefer to systems or portions of systems with an internal pressure lessthan or greater than atmospheric pressure.

The present disclosure generally relates to systems, devices and methodsfor analyzing and processing samples. The disclosed systems may includemodular aspects that permit the systems to be configured to analyze orprocess different types of samples. Additionally or alternatively, thesystems may include modular aspects to permit the systems to beconfigured to analyze or process samples by one or more differentmethods or techniques. Information about the samples may be obtainedthrough a variety of analysis techniques such as microscopy,spectroscopy, spectrometry, chromatography, as well as many others.Information about the samples may be used to conduct experiments;improve, control or monitor production processes; or improve, control ormonitor manufactured products.

In some configurations, the disclosed systems may be used in a labsetting to conduct experiments. For example, the configuration of thesystems may be selected for powders, liquids, gases, emulsions,suspensions, solids, homogeneous combinations, heterogeneouscombinations, pills, tablets, materials, biological samples, and/or anysuitable combinations thereof.

In other configurations, the disclosed systems may be used as a part ofproduction line to analyze and process samples to obtain informationabout aspects of the production line, such as characteristics of thefinished products or intermediaries of the products. The disclosedsystems may be implemented as in-process monitoring systems integratedinto a production line and configured to analyze one or more propertiesof a sample as it is being produced.

FIG. 1 is a schematic diagram of an example embodiment of a system 10that may be configured to analyze or process samples. The system 10 mayinclude an objective 12 optically coupled to an optical multiplexer 14.The optical multiplexer 14 may be optically coupled to a sensor 16, anemitter 18 and/or a detector 20. A sample 34 may be positioned on and/orover a window 30 that is optically coupled to the objective 12 and/orthe optical multiplexer 14. The system 10 may include a platform 22 thatmay be configured to move portions of the system 10 relative to thesample 34. In some configurations, the platform 22 may be configured tomove portions of the system 10 in three directions of movement (linear,non-linear, angular, etc.). At least some portions of the system 10 canbe translated in any of the three directions relative to the sample 34.In operation, the movement of the platform 22 may contribute to focusingoptical components of the system 10, scanning the sample 34, engaging ordisengaging portions of the system 10, and/or a combination thereof.

The emitter 18 may be configured to emit radiation to analyze the sample34. The emitter may emit any suitable electromagnetic radiation toanalyze and/or process the sample 34. For example, the emitter 18 mayemit visible light, ultraviolet light, X-rays, infrared or any othersuitable radiation. In some configurations, the emitter 18 may be alaser or diode. In some configurations, the emitter 18 may be a Ramanlaser source.

The detector 20 may be configured to detect radiation from the sample34. For example, the detector 20 may be configured to detect radiationfrom the sample 34 resulting from the radiation from the emitter 18incidenting the sample 34. The detected radiation may permit informationregarding the sample 34 to be obtained. In some configurations, thedetector 20 may be a Raman spectrometer.

An emitter 32 may be positioned around the window 30 and/or proximatethe sample 34 and configured to emit radiation that may incident thesample 34. In some configurations, the emitter 32 may be a ringencircling the window 30. In other configurations, the emitter 32 may beone or more discrete emitter elements positioned at various suitablepositions with respect to the window 30 and/or the sample 34. In someconfigurations, the emitter 32 may be an electromagnetic radiationsource or an electromagnetic radiation ring.

In some configurations, the system 10 may include a controller 28configured to control the operation of at least a portion of the system10. The controller 28 may include a processor 24 that executesinstructions stored in memory 26. The processor 24 and memory 26 can beincorporated into the system 10, as illustrated. In otherconfigurations, the processor 24 and/or the memory 26 can be located ina controller 28 external to the system 10. For example, the system 10may be controlled and/or operated by a computer system coupled to thesystem 10.

The memory 26 can include executable instructions that control theoperation of the system 10. For example, the memory 26 can compriseinstructions that when executed by the processor 24 causes the emitter32 to expose the sample 34 to emitted radiation (e.g., electromagnetic,visible light, ultraviolet, heat, microwave, or other radiation).Depending on the properties of the sample 34 and the characteristics ofthe emitted radiation, some of the radiation projected on the sample 34may pass through the sample 34, some may be absorbed by the sample 34,and/or some may be reflected by the sample 34.

Emissions from the irradiated sample 34 (for example, by reflection orfluorescence), may travel through the objective 12 into the opticalmultiplexer 14. At least a part of the emissions from the sample 34 maybe directed to the sensor 16 by the optical multiplexer 14. The sensor16 may detect characteristics of the received radiation, such as energylevel, wavelength, or other characteristics. The characteristics of thereceived radiation may be used to determine characteristics of thesample 34. For example, in some configurations, the characteristics ofthe received radiation may be used to determine aspects of the sample34.

The system 10 may be configured to use the sensor 16 to obtaininformation about the sample 34. For example, the sensor 16 may be animage sensor (e.g., a color camera, or monochromatic camera) configuredto obtain images of the irradiated sample 34. The controller 28 may beconfigured to receive, process, modulate, and/or convert signals fromthe sensor 16 to obtain information about the sample 34. In someconfigurations, the controller 28 may be configured to generate imagesof the sample 34 from the signals from the sensor 16. The controller 28can employ image analyzing algorithms to: (i) compare particle luminancemagnitude of the sample 34; (ii) detect particle sizes of the sample 34;(iii) compare particle sizes against other sizes in the sample 34 or toa database of particle sizes; (iv) compare particle sizes against othershapes in the sample 34 or to databases of particle shapes, and/or anysuitable combinations of these algorithms or others.

In some configurations, the emitter 32 emits electromagnetic radiationat a given wavelength of a plurality of wavelengths into the sample 34.The emitter 32 may include, for example, one or more emitters capable ofproducing electromagnetic radiation within a terahertz range. In anotherexample, a wavelength of the electromagnetic radiation may be within arange of approximately 0.01 to 10 nanometers. This range comprises X-raywavelengths. In yet another example, the electromagnetic radiationproduced by the emitter 32 may be varied in wavelength from blue toultraviolet light. In another example, the emitter 32 emits white light.The responsiveness of the sample 34 is determined by the controller 28by examining color of the one or more of the components of the sample34.

The emitter 32 may be multiple sources that each provides a uniquenarrow band wavelength of electromagnetic radiation. For example, eachof the emitters 32 may output any of red, blue, and green light. Theemitters 32 may include light emitting diodes and/or lasers.

In yet other configuration, the emitter 32 may expose the mixture sampleto near infrared or mid infrared light. The emitters 32 may producebroad band radiation or successive bursts of narrow bands of radiation.In one example, the emitters 32 may selectively expose the mixturesample to many different wavelengths of electromagnetic radiation andanalyzing how each wavelength affects components of the sample 34. Thisexample configuration may be used to analyze samples of unknowncomposition, although other configurations are contemplated.

The objective 12 may include a high, low, or variable magnificationobjective lens. The objective 12 may include a high magnification lensthat permits viewing of small particles (e.g., less than 20 microns insize) and/or viewing small features on larger particles. The objective12 may include low magnification lenses used to provide a large field ofview, which may permit rapid identification of regions of interest in animage. The magnification of the objective 12 may be selectively variedby the controller 28 to locate particles at low power settings. Thecontroller 28 may be configured execute analytical processes to identifythe particle by shape and/or size. The controller 28 may be configuredto zoom in where particles of certain characteristics are identified.

In some configurations, an optical filter may be optically coupled priorto the sensor 16 to block frequencies of radiation that may damage thesensor 16 and/or provide undesired effects on the information obtainedby the sensor 16. In some configurations, the optical filter may beselected depending on the wavelength of the electromagnetic radiationthat is output by the emitter 32. In some configurations, the opticalfilter may be configured to block light at wavelengths of approximately425 nanometers to 700 nanometers. In other configurations, higherwavelength filters may be used in combination with lower wavelengthfilters. For example, higher wavelength filters may be used, forexample, with Raman lasers, while lower wavelength filters may be usedwith, for example, ultraviolet light. In some configurations, theemitter 32 may be a laser optically coupled with a long pass filter. Inanother example, the emitter 32 may be a light emitting diode (LED)optically coupled to a long pass filter.

The system 10 may include one or more optical filters used to block theexcitation wavelength for the sensor 16 to permit the sensor 16 toobtain usable images. The controller 28 may be configured to activatethe emitter 32 for a set period of time, such as ten seconds. Images maybe captured of the sample 34 by the sensor 16 to determine theresponsiveness of at least portions of the sample 34 by detecting timingand decay of response of the one or more of the components of the sample34 to the radiation.

The system 10 may use additional measurement algorithms to detect anddifferentiate components of the sample 34 from one another usingparticle size and shape. For example, the controller 28 of the system 40can use various image processing methods to determine an aspect ratiofor particles of components of the sample 34. Also, the controller 28 ofthe system 10 can calculate size, shape, fuzziness, angularity,brightness, and combinations thereof for components of the sample 34.

The size and/or shape of components of the sample 34 may be used todetect the presence of paper fibers or other contaminates. For example,if a particle is detected, its size and shape may be calculated usingimage processing. The size and shape may be compared to a database ofparticle sizes and corresponding shapes. If no reasonable comparison isfound, a particle may be determined to be a contaminate. Contaminatesmay be catalogued and/or stored in a database. In some configurations ofthe system 10, contaminants may be isolated, concentrated, separated,stored, and/or disposed, as will be described in further detail belowwith respect to FIGS. 9A-9D. The algorithm used by the controller 28 maybe selected based on the composition of the sample 34, if an expectedcomposition for the sample 34 is known.

With continued reference to FIG. 1, the emitter 32 may emitelectromagnetic radiation into the mixture sample at an angle B that isspecified with reference to a central axis C of the window 30. In suchconfigurations, radiation may enter the sample 34 at the angle B.

The controller 28 may be configured to detect, track and/or count anumber of excited particles in the sample 34. The controller 28 may befurther configured to calculate a concentration of a selected componentof the sample 34. For example, when the controller 28 has located anumber of a first component of the sample 34, the controller 28 maycalculate a volume of the first component of the sample 34, for example,using image analysis. The overall area of the particles of the firstcomponent relative to the total area of the image may be used toestimate the volume by weight of the first component, if the size of thefirst component particles is known.

In some configurations, Raman spectroscopy may be used to verify and/oranalyze the presence, size, and/or shape of components of the sample 34.In such configurations, the emitter 18 may be a Raman laser source andthe detector 20 may be a Raman spectrometer. The emitter 18 may becontrolled, for example, by the controller 28 to expose the sample 34 toa wavelength of laser light. The laser light may be focused onto a smallportion of the sample 34 where candidate particles are fluorescing(e.g., responsive). Images may be transferred by the optical multiplexer14 to the Raman spectrometer detector 20 via a Raman spectrometerinterface. The Raman spectrometer 20 and or the Raman spectrometerinterface may be integrated into the system 10 or may be a standaloneexternal feature. In some circumstances, the identification of thecandidate particles may be confirmed using Raman spectroscopy.

In other configurations, the emitter 18 may instead be an X-ray source,near infrared source, infrared source, ultra violet source, and/or anysource of radiation suitable for an intended application. The system 10may include any suitable combinations or permutations of these or otherradiation sources, depending on the type of analytes being analyzedand/or the desired information to be obtained.

In some configurations, the system 10 may be used to obtainthree-dimensional models of the sample 34. A three dimensional model maybe a composition of many images obtained using permutations of positionsin three axes X, Y, and Z. For example, the objective 12 may be moved inthree directions of movement along three axes X, Y, and Z by theplatform 22. The Z-axis may be aligned with the central axis C of thewindow 30. Depending on the width of the field of view of the sensor 16,the objective 12 may be moved sequentially along the window 30 in the Xand Y direction. At each X and Y location, the platform 22 may translatethe objective 12 from an initial position along the Z-axis towards thewindow 30, in increments (e.g., one micron increments, etc.). At eachincrement, the sensor 16 may obtain an image of the illuminated sample34. The system 10 may be capable of obtaining images at any given depthinto the sample 34. These images may each be associated with theirrespective X, Y, and Z location information. The images may be assembledtogether by the system 10, for example via the controller 28, to form athree-dimensional model of the sample 34.

The three-dimensional imaging of the sample 34 may be used to calculateresponsive particles of a component of the sample 34 on a surface of thesample 34, as well as particles located within the sample 34 at aspecified distance inside the surface of the sample 34.

A method of analyzing the sample 34 using the system 10 will bedescribed in further detail. The method may include capturing highresolution color images of the sample 34 exposed with multiple colorlighting (e.g., a range of wavelengths of electromagnetic radiation).The multiple color lighting of the sample 34 may occur at multipleangles of incidence and/or from different directions. For example, theangle B may be selectively varied during illumination of the sample 34.The method may include processing the images to identify possibleparticles of a first component of the sample 34 by size, color, and/orshape. The method may include using Raman scanning and analysis topositively identify candidate particles as particles of the firstcomponent. This may be accomplished using a Raman signature forparticles of the first component as a baseline. The method may includecalculating a particle area to percentage-by-weight calculation where apercentage-by-weight is correlated to a percentage-by-area of particlesof the first component observed in the images. The method may berepeated until a statistically significant particle area is located inone or more components of the sample 34 and/or multiple samples.

The system 10 may include any suitable aspects described in U.S. patentapplication Ser. No. 14/507,637, entitled “OPTICAL AND CHEMICALANALYTICAL SYSTEMS AND METHODS” and U.S. patent application Ser. No.14/454,483, entitled “ANALYSIS AND PURGING OF MATERIALS IN MANUFACTURINGPROCESSES,” which are both incorporated by reference in their entiretyand for all purposes. The concepts described with respect to the system10 may be implemented in a variety of configurations and may be combinedwith other aspects of this disclosure, as may be indicated by context.

Turning to FIGS. 2A-2E, an example embodiment of a system 40 that can beconfigured to analyze or process samples will be described. In someconfigurations, the system 40 may be an implementation of the system 10of FIG. 1. Accordingly, the system 40 may include any suitable aspectsdescribed with respect to system 10, as may be indicated by context.

FIGS. 2A and 2B are perspective views of a portion of the system 40. Asillustrated, the system 40 may include a housing 42 surrounding at leasta portion of the system 40. The system 40 may include an interfaceassembly 80 configured to interface with other portions of the system40, as will be described in further detail below. The interface assembly80 may include a body 82 and a window 84 that is configured to permitlight to travel through at least a portion of the interface assembly 80.The window 84 may be at least partially transparent or translucentand/or may be configured to convey, direct, collimate and/or focus lighttravelling through the interface assembly 80. In the illustratedconfiguration, the interface assembly 80 is positioned on a top portionof the housing 42, although other suitable configurations arecontemplated.

Turning to FIG. 2B, the system 40 may include a first connector 44, asecond connector 46, and a third connector 48 connecting portions of thesystem 40 inside of the housing 42 to portions of the system 40 exteriorto the housing 42. The connectors 44, 46, and 48 may be electronicconnectors configured to transmit data, power and/or control signals.The system 40 may include a switch 52 that may be configured to activateand/or turn on at least portions of the system 40.

As illustrated, the first connector 44 may be a socket configured toreceive a first plug to electrically couple the system 40 and the secondconnector 46 may be a socket configured to receive a second plug toelectrically couple the system 40. The first connector 44 may permit thesystem 40 to be electrically coupled to a power source, for example, analternating current (AC) power supply. The second connector 46 may be asocket configured to transmit data, power and/or control signals inand/or out of portions of the system 40 inside of the housing 42.

As illustrated, the third connector 48 may be a cable connector coupledwith the housing 42 by a connector panel 50. In the illustratedconfiguration, the third connector 48 is a Universal Serial Bus (USB)cable extending from the system 40. In such configurations, the thirdconnector 48 may transmit one or more of data, power and/or controlsignals. In other configurations, the third connector 48 may be anysuitable connector that may or may not correspond to an interfacestandard or interface protocol (such as USB, firewire, etc.). Theconnector panel 50 may include a connector 51 which may be, for example,a fluid connector or a vacuum connector.

In some configurations, the third connector 48 may permit the system 40to be coupled to electronic components such as computers, computersystems, computer interfaces, user interfaces, mobile devices and/or anyother suitable electronic component. In such configurations, theelectronic component may provide power and/or control signals to thesystem 40 via the third connector 48. Additionally or alternatively, theelectronic component may receive data signals and/or feedback from thesystem 40 via the third connector 48. In other configurations, the thirdconnector 48 may permit the system 40 to be coupled to other componentsof the system 40. In such configurations, portions of the system 40 (forexample, portions inside of the housing 42) may provide power and/orcontrol signals to at least one other component of the system 40 via thethird connector 48. Additionally or alternatively, portions of thesystem 40 (for example, portions inside of the housing 42) may receivedata signals and/or feedback from at least one other component of thesystem 40 via the third connector 48. The connector panel 50 may beremovably coupled to the housing 42 to permit connectors of differenttypes to be coupled to the system 40.

In some configurations, the system 40 may include non-illustratedconnectors such as a fluid connector configured to permit fluid(gaseous, liquid, or otherwise) to travel into or out of the housing 42.Fluid connectors may permit the system 40 to be coupled with, forexample, vacuum lines, pressurized gas lines, cooling fluid lines, waterlines, liquid lines, or other suitable fluids. Although the illustratedconfiguration includes three connectors 44, 46, and 48, the system 40may include any suitable amount of connectors and may include connectorsof any suitable type. The configurations of the connectors may beselected based on the desired configuration and/or functionality of thesystem 40, as applicable. Additionally or alternatively, theconfiguration of the connectors may be selected depending on modularcomponents that may be coupled, added and/or activated with the system40.

The system 40 may include a security assembly 54 that may be configuredto lock the system 40 from being operated. For example, the securityassembly 54 may disable portions of the system 40 such as emitters fromoperating to facilitate in preventing inadvertent exposure toelectromagnetic radiation. In some configurations, the security assembly54 may disconnect power from one or more emitters of the system 40. Thesecurity assembly 54 may facilitate in preventing operation of thesystem 40 in a potentially unsafe manner and/or may facilitate inpreventing inadvertent exposure to electromagnetic radiation when thesystem 40 is being serviced. In the illustrated configuration, thesecurity assembly 54 is a key and a lock configured to receive the key.In other configurations, the security assembly 54 may include anysuitable electronic and/or mechanical locking mechanism. For example,biometric and/or cryptographic key locking mechanisms (password,passphrase, personal identification number, etc.) may be employed. Thesecurity assembly 54 may facilitate safe operation of the system 40 bypermitting only qualified users to operate the system 40.

The system 40 may include a temperature management assembly 56configured to facilitate temperature control of at least a portion ofthe system 40. For example, the temperature management assembly 56 mayheat or cool portions of the system 40, such as those positioned withinthe housing 42, to maintain desired or suitable operating conditions. Asillustrated for example in FIG. 2E, in some configurations thetemperature management assembly 56 may include a heat sink 36 positionedbetween a first ventilator 38 and a second ventilator 58. The heat sink36 may be configured to transmit heat by conduction and maintainseparation between the interior and the exterior of the housing 42. Thefirst ventilator 38 and second ventilator 58 may be configured to driveair and/or other fluids along the surfaces of the heat sink 36 tofacilitate heat management. In other configurations, the temperaturemanagement assembly 56 may include any suitable heating and/or coolingmechanisms.

Although in the illustrated configuration components of the system 40such as the switch 52, the security assembly 54, the temperaturemanagement assembly 56, and the connectors 44, 46, 48 are positioned onone end of the housing 42, such components may be positioned at anysuitable position in the system 40. In some configurations, at least oneof the components may be positioned, for example, inside of the housing.

FIGS. 2C, 2D, and 2E illustrate portions of the system 40 inside of thehousing 42, which is represented by dashed lines. As illustrated, thesystem 40 may include a head assembly 70, a power assembly 60, anemitter assembly 62, a detector assembly 64, and an electronic assembly66 positioned inside of the housing 42. The head assembly 70 may bemechanically coupled to the interface assembly 80 and/or opticallycoupled to receive and/or transmit electromagnetic radiation to/from theinterface assembly 80. The head assembly 70 is omitted from FIG. 2E toillustrate other portions of the system 40.

The power assembly 60 may be configured to control, distribute and/ormodulate power supplied to portions of the system 40. In someconfigurations, the power assembly 60 may be electrically coupled withvarious portions of the system 40 by electrical couplings such as cables(not illustrated).

The emitter assembly 62 may include an emitter such as the emitter 18and the detector assembly 64 may include a detector such as detector 20as described with respect to FIG. 1. The emitter assembly 62 may includea first interface 72 and the detector assembly 64 may include a secondinterface 74. In some configurations, the first and second interfaces72, 74 may be optical interfaces configured to optically couple theemitter assembly 62 and/or the detector assembly 64. For example, thefirst interface 72 may optically couple the emitter assembly 62 to thehead assembly 70 via, for example, an optical cable (not illustrated).In another example, the second interface 74 may optically couple thedetector assembly 64 to the head assembly 70 via, for example, anoptical cable (not illustrated). The emitter assembly 62 may beconfigured to transmit radiation to the head assembly 70 and/or thedetector assembly 64 may be configured to receive radiation from thehead assembly 70 to obtain information about samples. In someconfigurations, the emitter assembly 62 may be a Raman laser sourceassembly and the detector 20 may be a Raman spectrometer assembly.

In an example implementation, the head assembly 70 may include anobjective, an optical multiplexer, a sensor and/or platform such as theobjective 12, the optical multiplexer 14, the sensor 16, and/or platform22 as described with respect to FIG. 1. Additionally or alternatively,the head assembly 70 may include a controller such as controller 28 asdescribed with respect to FIG. 1. The head assembly 70 will be describedin further detail below with respect to FIGS. 3A-3F.

The electronic assembly 66 may be configured to distribute data, powerand/or control signals to various portions of the system 40. Theelectronic assembly 66 may include one or more connectors 76, 78configured to couple various components of the system 40. In someconfigurations, the electronic assembly 66 may be a USB hub.

FIGS. 3A-3D illustrate perspective views of an example implementation ofthe head assembly, denoted generally at 70. FIGS. 3E and 3F illustratethe head assembly 70 with some portions omitted to illustrate otherdetails of the head assembly 70. As illustrated, the head assembly 70may be optically coupled to receive and/or transmit electromagneticradiation to/from the interface assembly 80. Specifically, the headassembly 70 may include an objective 102 (see for example FIGS. 3E and3F) coupled to the interface assembly 80. The objective 102 may includeoptics configured to convey, direct, collimate and/or focuselectromagnetic radiation travelling between the head assembly 70 andthe interface assembly 80. As illustrated for example in FIG. 3F, theobjective 102 may be optically coupled to an optical multiplexer 104.The optical multiplexer 104 may be configured to distributeelectromagnetic radiation travelling through the head assembly 70 and/orother portions of the system 40. Additionally or alternatively, theoptical multiplexer 104 may be configured to convey, direct, collimateand/or focus electromagnetic radiation travelling through the headassembly 70 and/or other portions of the system 40.

The head assembly 70 may include a sensor 106 configured to detectcharacteristics of received electromagnetic radiation such as energylevel, wavelength, or other characteristics (for example, as describedabove with respect to the system 10). The characteristics of thereceived radiation may be used to determine characteristics of samples.In some configurations, the sensor 106 may be an image sensor (e.g., acolor camera, or monochromatic camera) configured to obtain images ofsamples. An optical assembly 108 may be optically coupled between theoptical multiplexer 104 and the sensor 106. The optical assembly 108 maybe configured to convey, direct, collimate and/or focus electromagneticradiation travelling between the optical multiplexer 104 and the sensor106. The sensor 106 may include a first connector 110 and/or a secondconnector 112 configured to transmit data, power and/or control signalsbetween the sensor 106 and other portions of the head assembly 70.

The head assembly 70 may be configured such that portions of the headassembly 70 may be moved with respect to the interface assembly 80. Forexample, in some configurations, the head assembly 70 may move at leastthe objective 102 with respect to the interface assembly 80. In someconfigurations, the head assembly 70 may be configured to move portionsof the head assembly 70 in three directions of movement (linear,non-linear, angular, etc.), for example, along three axes: X, Y, and Z.In operation, the movement of portions of the head assembly 70 such asthe objective 102 may contribute to focusing and/or scanning thesamples.

As illustrated for example in FIG. 3E, the head assembly 70 may includeone or more motors or actuators 160, 170, 180. Each of the actuators160, 170, 180 may be coupled to a corresponding slide 162, 172, 172configured to the permit portions of the head assembly 70 (e.g., theobjective 102) to move with respect to the interface assembly 80. In theillustrated configuration, each actuator 160, 170, 180 and slide 162,172, 172 corresponds to a direction of movement X, Y, and Z. Innon-illustrated configurations, the head assembly 70 may include less ormore directions of movement, and/or such directions may or may not beorthogonal to one another. Each of the actuators 160, 170, 180 mayinclude a corresponding connector 164, 174, and 184. The connectors 164,174, 184 may be configured to couple the actuators 160, 170, 180 toother portions of the head assembly 70. The connectors 164, 174, 184 maybe electronic connectors configured to transmit data, power and/orcontrol signals. The connectors 164, 174, 184 may transmit power and/orcontrol signals to drive and/or operate the actuators 160, 170, 180 tomove portions of the head assembly 70 with respect to the interfaceassembly 80. The head assembly 70 may include stops corresponding witheach of the directions of movement to limit the movement of the portionsof the head assembly 70 with respect to the interface assembly 80.

In the illustrated configuration, portions of the head assembly 70actuate in three linear directions of movement. In other configurations,the head assembly 70 may actuate in any suitable directions of movement,and such directions of movement may not be linear (e.g., rotational,angular, non-linear, etc.). In some configurations, the head assembly 70may include mirrors that may be rotated and/or actuated to deflectoptical beams rather than moving other portions of the head assembly 70.

The head assembly 70 may include an electronic assembly 114 with acontroller configured to control the operation of at least a portion ofthe system 10. The electronic assembly 114 may be configured todistribute power and/or control signals to other components of the headassembly 70. The electronic assembly 114 may be configured to receivedata signals from other components of the head assembly 70, such as thesensor 106.

Specifically, the electronic assembly 114 may include one or moreconnectors 116 configured to couple the electronic assembly 114 to otherportions of the head assembly 70. The connector 116 may be electronicconnector configured to transmit data, power and/or control signals. Theconnector 116 may be coupled to other portions of the head assembly 70,such as the sensor 106, the actuators 160, 170, 180 and/or othercomponents. Additionally or alternatively, the connector 116 may becoupled to other portions of the system 40.

The electronic assembly 114 may include a processor that executesinstructions stored in memory. As illustrated, the electronic assembly114 may be incorporated into the head assembly 70. In otherconfigurations, the electronic assembly 114 may be a separate componentexternal to the head assembly 70. For example, the head assembly 70 maybe controlled and/or operated by a computer system coupled to the headassembly 70. The electronic assembly 114 can include executableinstructions that control the operation of the head assembly 70. Forexample, the electronic assembly 114 can include instructions that whenexecuted cause the head assembly 70 to analyze and/or scan one or moresamples.

The head assembly 70 may include an electronic assembly 126, which insome configurations may be a temperature management assembly configuredto manage the temperature of portions of the head assembly 70. Forexample, the electronic assembly 126 may be configured to cool portionsof the head assembly 70. The electronic assembly 126 may include aPeltier device, Peltier heat pump, solid state refrigerator, and/or athermoelectric cooler. The electronic assembly 126 may include acontroller configured to manage the temperature of portions of the headassembly 70 by controlling the operation of a Peltier device, Peltierheat pump, solid state refrigerator, and/or a thermoelectric cooler.

As illustrated for example in FIG. 3F, the head assembly 70 may includean emitter 132 configured to emit radiation to analyze samples. Theemitter 132 may emit any suitable electromagnetic radiation to analyzeand/or process samples. For example, the emitter 132 may emit visiblelight, ultraviolet light, X-rays, infrared or any other suitableradiation. In some configurations, the emitter 132 may be a laser ordiode. In some configurations, the emitter 132 may be a Raman lasersource. The emitter 132 may be optically coupled with the opticalmultiplexer 104. In such configurations, the optical multiplexer 104 maybe configured to convey, direct, collimate and/or focus electromagneticradiation from the emitter 132. For example, the optical multiplexer 104may be configured to direct radiation from the emitter 132 to a sample.

In addition to or as an alternative to the emitter 132, the headassembly 70 may include an optical interface 128 configured to opticallycouple the head assembly 70 to other components of the system 40. Forexample, the optical interface 128 may couple the head assembly 70 to anemitter, such as the emitter assembly 62 as described above with respectto FIGS. 2C and 2E. The optical interface 128 may optically couple thehead assembly 70 to the emitter assembly 62 via, for example, an opticalcable (not illustrated). The emitter assembly 62 may be configured totransmit electromagnetic radiation to the head assembly 70. In suchconfigurations, the optical multiplexer 104 may be configured to convey,direct, collimate and/or focus electromagnetic radiation from theemitter assembly 62. For example, the optical multiplexer 104 may beconfigured to direct radiation from the emitter assembly 62 to a sample.

The head assembly 70 may include a second optical interface 130configured to optically couple the head assembly 70 to other componentsof the system 40. For example, the optical interface 130 may couple thehead assembly 70 to a detector, such as the detector assembly 64 asillustrated and described with respect to FIGS. 2C and 2E, for example.The optical interface 130 may optically couple the head assembly 70 tothe detector assembly 64 via, for example, an optical cable (notillustrated). The detector assembly 64 may be configured to receiveradiation from the head assembly 70 to obtain information about samples.In such configurations, the optical multiplexer 104 may be configured toconvey, direct, collimate and/or focus electromagnetic radiation to thedetector assembly 64. For example, the optical multiplexer 104 may beconfigured to distribute radiation from samples to the detector assembly64.

The head assembly 70 may include one or more support members 134, 136,138, 140 configured to support, enclose, and/or couple portions of thehead assembly 70 to one another. The configuration of the supportmembers 134, 136, 138, 140 may permit portions of the head assembly 70to move in the X, Y, and Z directions. Additionally or alternatively,the configuration of the support members 134, 136, 138, 140 may limitthe range of motion of portions of the head assembly 70 in the X, Y, andZ directions.

The head assembly 70 may include one or more heat sinks 120, 122, 124configured to facilitate cooling of portions of the head assembly 70. Insome configurations, the heat sinks 120, 122, 124 may be configured tocool specific components of the head assembly 70. For example, in theillustrated configuration, the heat sink 120 is configured to cool theemitter 132, the heat sink 122 is configured to cool the sensor 106 andthe heat sink 124 is configured to cool the electronic assembly 126 orother portions of the head assembly 70. In other configurations, thehead assembly 70 may include more or less heat sinks; the heat sinks120, 122, 124 may be configured in other manners; or may be omittedentirely. Additionally or alternatively, the temperature of thecomponents of the head assembly 70 may be managed by other temperaturecontrol systems and/or mechanisms.

In some configurations, the head assembly 70 may include any suitableaspects as described with respect to the system 10 of FIG. 1.

FIGS. 4A and 4B illustrate one example embodiment of the interfaceassembly, denoted generally at 80, in further detail. The interfaceassembly 80 may be configured to interface with other portions of thesystem 40, such as the head assembly 70 and/or other components of thesystem 40 that will be described in further detail below. Asillustrated, the body 82 of the interface assembly 80 defines anaperture 86 extending at least partially through the interface assembly80. The aperture 86 may be configured (e.g. shaped and/or dimensioned)to permit electromagnetic radiation to travel through at least a portionof the interface assembly 80 to the window 84. The window 84 may be atleast partially transparent or translucent and/or may be configured toconvey, direct, collimate and/or focus light travelling through theinterface assembly 80.

As illustrated for example in FIG. 4B, the body 82 of the interfaceassembly 80 may define a receptacle 88 with an optoelectronic assembly90 positioned therein. The optoelectronic assembly 90 will be describedin further detail below with respect to FIGS. 5A-5B. The optoelectronicassembly 90 may be removably or non-removably fastened to the body 82 ofthe interface assembly 80 inside of the receptacle 88. Theoptoelectronic assembly 90 may include a body 92 and a connector 94coupled to the body 92. In some configurations, the body 92 may be anelectronic board such as a printed circuit board (PCB). The connector 94may be configured to couple the optoelectronic assembly 90 to otherportions of the system 40. The body 92 may include an opening furtherdefining the aperture 86 of the interface assembly 80.

Turning to FIGS. 5A and 5B, the optoelectronic assembly 90 will bedescribed in further detail. As illustrated, the optoelectronic assembly90 may include one or more emitters 96 positioned around the aperture86. One or more polarizers 98 may be positioned between each of theemitter 96 and the aperture 86. The emitters 96 may be configured toemit visible light, ultraviolet light, X-rays, infrared or any othersuitable radiation. The emitter 96 may be any suitable electromagneticradiation source. In some configurations, the emitter 96 may be a laseror a diode. In some configurations, the optoelectronic assembly 90 mayinclude multiple emitters 96 and one or more of the emitters 96 may beconfigured to output electromagnetic radiation of differentcharacteristics from one another. The emitters 96 may be electricallycoupled to the connector 94 by any suitable electrical coupling. Forexample, the emitters 96 may be electrically coupled to the connector 94by conductive traces printed on the body 92 or running through the body92. The connector 94 may be coupled to other portions of the system 40.The connector 94 may permit power and/or control signals to betransmitted to the emitters 96. The connector 94 may also permitfeedback and/or data to be transmitted from the optoelectronic assembly90 to other portions of the system 40.

As illustrated for example in FIG. 5A, a heat conductive material 99 maybe coupled to the body 92. The heat conductive material 99 may beconfigured to facilitate managing the temperature of the optoelectronicassembly 90 and/or the interface assembly 80. For example, the heatconductive material 99 may permit heat to be dissipated from portions ofthe optoelectronic assembly 90 and/or the interface assembly 80.Specifically, heat generated during operation of the emitters 96 may beconducted through the heat conductive material 99 and may dissipate awayfrom the emitters 96. Additionally or alternatively, the heat conductivematerial 99 may dissipate heat from the polarizers 98 and/or otherportions of the interface assembly 80. In some configurations, the heatconductive material 99 may be copper or may at least partially includecopper.

FIG. 5C illustrates a cross-sectional view of the interface assembly 80with the optoelectronic assembly 90. In operation, a sample may bepositioned over the window 84 and the head assembly 70 may be activatedto analyze and/or process the sample. In some configurations, the window84 may be sealed to the body 82 such that substances may not travelbetween the window 84 and the body 82 at their interface. For example,the interface assembly 80 may include a seal such as an O-ring betweenthe window 84 and the body 82. The window 84 and/or the aperture 86 maypermit light to travel through the interface assembly 80, for example,between the sample and the objective 102 of the head assembly 70. Theoptoelectronic assembly 90 may be coupled to the body 82 such that theobjective 102 of the head assembly 70 is a specified distance or rangeof distances from the optoelectronic assembly 90.

FIGS. 6A-6C illustrate the system 40 with different exampleconfigurations to process samples of different types and/or by differentmethods or techniques. FIG. 6A illustrates the system 40 with a device200 configured to analyze one or more samples positioned in a sampletray. FIG. 6B illustrates the system 40 with a device 300 configured toanalyze layers of samples, for example pills, tablets, capsules,medication, pellets, and/or other substances. FIG. 6C illustrates thesystem 40 with a device 400 configured to analyze particle samples suchas powders, granules, and/or other substances. The system 40 may also beconfigured to analyze fluid samples such as liquids, gels, gases, and/orother substances. In such configurations, the system 40 may include aninterface assembly 80 adapted to receive, deliver, process and/oranalyze liquids, gels, gases, and/or other substances.

As mentioned above, the system 40 may be modular to permit the system 40to be configured to analyze or process different types of samples.Additionally or alternatively, the system 40 may be modular to permitthe system 40 to be configured to analyze or process samples by one ormore different methods or techniques. Specifically, the interfaceassembly 80 may interface with modular components and/or devices. Themodular components and/or devices may be configured to process, prepareand/or deliver analytes or samples over the window 84 to be analyzed bythe system 40. The modular components and/or devices may includeconfigurations suited for processing a specific type of sample oranalyzing samples by a specific method or process. Additionally oralternatively, the modular components and/or devices may be configuredto process samples either before or after they are analyzed, or both.For example, the modular components and/or devices may prepare thesamples to be analyzed by the system 40. In another example, the modularcomponents and/or devices may sort and/or separate samples after thesamples are analyzed, for example, based on information obtained whenthe samples were analyzed.

Turning to FIGS. 7A-7H, one example embodiment of the device 400 will bedescribed in further detail. FIGS. 7A and 7B are perspective views ofthe device 400. As illustrated, the device 400 may include a first bodyportion 432 and a second body portion 434 coupled to one another. Thedevice 400 may include a sample feeder such as a hopper 402 configuredto receive a substance to be analyzed by the system 40. A housing 404surrounding at least a portion of the device 400 may be positioned overand/or coupled to the body portion 434 adjacent to the hopper 402.

As illustrated, the hopper 402 may be positioned over and/or coupled tothe body portion 434. The hopper 402 may feed substances into the device400 to be analyzed and/or processed by the system 40. The hopper 402 maybe configured to retain substances before they are analyzed and/orprocessed. Specifically, the hopper 402 may define a receptacle 403configured to retain substances and/or feed substances into the device400. The substances may be particle samples such as powders, granules,particulates, fragments, portions and/or other substances. In someconfigurations, the substances may be granular samples and/orpharmaceutical micro-structured blends of substances.

In other configurations, the device 400 may include other suitablesample feeders instead of the hopper 402. For example, the sample feedermay be a receptacle or compartment configured to retain substances. Insome configurations, the sample feeder may be a conduit permittingsubstances to be analyzed from a production process. The sample feedermay be a continuous or semi-continuous feed of substance. For example,the sample feeder may be a conduit permitting substances in a productionprocess to be continuously or semi-continuously analyzed by the system40.

FIG. 7B illustrates the device 400 including the interface assembly 80of the system 40. As illustrated, the device 400 may include a firstconnector 406, and a second connector 408 connecting portions of thedevice 400 inside of the housing 404 to other portions of the system 40.The connectors 406 and 408 may be electronic connectors configured totransmit data, power and/or control signals. In some configurations, theconnector 406 may be coupled to corresponding connector 46 of the system40 and/or the connector 408 may be coupled to corresponding connector 48of the system 40.

The device 400 may be coupled to the interface assembly 80 to permitsubstances to be analyzed and/or processed by the head assembly 70 viathe interface assembly 80. In some configurations, the device 400 may bepositioned over the housing 42 of the system 40 and coupled to thesystem 40 via the interface assembly 80. As illustrated for example inFIG. 7B, the interface assembly 80 may be positioned in a receptacledefined by the body portion 432. The receptacle may be sized and/orshaped to receive the interface assembly 80. When the device 400 ispositioned around the interface assembly 80, it may be supported by thehousing 42 (see for example, FIG. 6C). The interface assembly 80 may beremovably or non-removably coupled to the device 400 by any suitablefasteners, couplings, and/or adhesives. In other configurations, theinterface assembly 80 may be integrally formed with the device 400. Forexample, the interface assembly 80 may be integrally formed as part ofthe body portion 432.

FIG. 7C illustrates the device 400 with the hopper 402 and the housing404 not shown. As illustrated, the device 400 may include an inlet 410and an outlet 414 which may be positioned on the body portion 434. Thebody portion 434 may define an outlet conduit 416 configured to permitgaseous or liquid fluid to exit the device 400. Additionally oralternatively, the body portion 434 may define an inlet conduit 412configured to permit gaseous or liquid fluid to enter the device 400. Insome circumstances, the gaseous or liquid fluid may include solidsubstances and/or particles. For example, fluid exiting the device 400via the outlet conduit 416 may include solid substances after they havebeen analyzed and/or processed by the system 40 including the device400.

FIG. 7D is a perspective view of the device 400 with portions not shownto illustrate aspects of the device 400. FIG. 7E illustrates a top viewof the device 400 with the housing 404 not shown and the hopper 402, theinlet conduit 412, and the outlet conduit 416 represented with dashedlines. As illustrated for example in FIGS. 7D and 7E, the device 400 mayinclude one or more motors or actuators 422. In some configurations, forexample if the actuator 422 is a rotational motor, the actuator 422 maybe coupled to a corresponding transmission member 424 such as a leadscrew configured to translate rotational motion to linear motion. Inother configurations, the actuator 422 may be a linear actuatorconfigured to convey linear motion, and the transmission member 424 maybe a shaft, coupling member, and/or omitted altogether. As illustrated,the transmission member 424 may be coupled to a shuttle 428 such thatthe actuator 422 may drive the shuttle 428 along the direction ofmovement S.

The device 400 may include an electronic assembly 420 with one or moreconnectors 426. The connector 426 may be an electronic connectorconfigured to transmit data, power, feedback and/or control signals. Insome configurations, the connector 426 may be coupled to other portionsof the device 400 and/or to other portions of the system 40. Theelectronic assembly 420 may include cables electrically coupled tocorresponding connectors of the actuator 422 (not illustrated).

The electronic assembly 420 may include a controller configured tocontrol the operation of at least a portion of the device 400. Theelectronic assembly 420 may be configured to distribute power and/orcontrol signals to other components of the device 400, such as theactuator 422. The electronic assembly 420 may be configured to receivedata signals and/or feedback from the actuator 422. The electronicassembly 420 may be configured to receive power and/or control signalsfrom other portions of the system 40, and/or may distribute such powerand/or control signals to portions of the device 400, such as theactuator 422. In some configurations, the electronic assembly 420 mayinclude any suitable aspects described with respect to the controller28.

The electronic assembly 420 may include a processor that executesinstructions stored in memory. As illustrated, the electronic assembly420 may be incorporated into the device 400. In other configurations,the electronic assembly 420 may be positioned as a separate componentexternal to the device 400. For example, the device 400 may becontrolled and/or operated by a computer system coupled to the device400. The electronic assembly 420 can include executable instructionsthat control the operation of the device 400. For example, theelectronic assembly 420 can include instructions that when executedcause the device 400 to move the shuttle 428 to analyze and/or scansubstances positioned in the hopper 402.

The electronic assembly 420 and/or the actuator 422 may be at leastpartially enclosed by the housing 404 with connectors configured totransmit data, power and/or control signals between the electronicassembly 420, the actuator 422 and/or other portions of the system 40.

FIGS. 7F-7H are cross-sectional views of the device 400 coupled to theinterface assembly 80 and including a substance 450 positioned in thereceptacle 403 of the hopper 402. The substance 450 may be particlesamples such as powders, granules, particulates, fragments, portionsand/or other substances. In some configurations, the substance 450 maybe granular samples and/or pharmaceutical micro-structured blends ofsubstances.

As illustrated for example in FIG. 7F, the inlet conduit 412 may extendthrough the body portion 434 and fluidly couple a sample chamber 418defined between the interface assembly 80 and the device 400. The outletconduit 416 may extend through the body portion 434 and fluidly couplethe chamber 418. The inlet conduit 412 may permit gaseous or liquidfluid to enter the chamber 418 and the outlet conduit 416 may beconfigured to permit gaseous or liquid fluid to leave the chamber 418.

With reference to FIGS. 7F-7H, example embodiments of the hopper 402 andthe receptacle 403 will be described in further detail. As illustrated,the receptacle 403 may include a taper 444 positioned between a firstportion 446 and a second portion 448. The taper 444 may be configured todirect substances into a passage 438 of the shuttle 428. The firstportion 446 may be sized and shaped to the receive substances. The taper444 may narrow the receptacle 403 such that the second portion 448 maybe smaller than the first portion 446. For example, the second portion448 may include one or more dimensions less than correspondingdimensions of the first portion 446. As illustrated for example in FIG.7F, the second portion 448 of the receptacle 403 may be sized and/orshaped to correspond to the passage 438 of the shuttle 428. For example,the second portion 448 may include one or more dimensions substantiallythe same as corresponding dimensions of the passage 438 of the shuttle428. Such configurations may facilitate directing substances into thepassage 438 of the shuttle 428.

As illustrated in FIG. 7F, the chamber 418 may be defined between thewindow 84 of the interface assembly 80 and the shuttle 428.Specifically, in the illustrated configuration, the chamber 418 isdefined at least partially by the window 84 and the shuttle 428.Substances positioned over the window 84 in the chamber 418 may beanalyzed and/or processed by the head assembly 70 via the interfaceassembly 80.

The size and/or shape of the chamber 418 may determine how muchsubstance may enter the chamber 418 to be analyzed and/or processed. Asillustrated for example in FIG. 7F, the chamber 418 may include adimension W that may contribute to determining how much substance mayenter the chamber 418 to be analyzed and/or processed. The size ofdimension W may be varied to control the volume of substance that mayenter the chamber 418.

As indicated by the arrows of the inlet conduit 412 and the outletconduit 416 in FIG. 7F, gaseous or liquid fluid may be directed throughthe inlet conduit 412, the chamber 418 and the outlet conduit 416 toevacuate the chamber 418. For example, fluid (e.g., air, etc.) may bedirected through the chamber 418 via the inlet conduit 412 and theoutlet conduit 416 to remove samples positioned inside of the chamber418. In another example, fluid may be directed through the chamber 418to remove undesired substances such as contaminants from the chamber418. In yet another example, a pressure differential generateddownstream of the outlet conduit 416 may evacuate the chamber 418 by wayof the inlet conduit 412 and the outlet conduit 416. In non-illustratedconfigurations, the inlet conduit 412 may be omitted and the chamber 418may be evacuated via the passage 438 of the shuttle 428.

As illustrated for example in FIGS. 7C-7E, the shuttle 428 may definethe passage 438 configured to permit substances from the hopper 402 toenter the chamber 418. Turning to FIGS. 7G-7H, the passage 438 mayinclude a taper 464 positioned between a first portion 466 and a secondportion 468. The first portion 466 may be sized and shaped to thereceive substance 450 from the receptacle 403 of the hopper 402. Forexample, the first portion 466 of the passage 438 may be sized and/orshaped to correspond to the second portion 448 of the receptacle 403. Asillustrated for example in FIG. 7F, the first portion 466 of the passage438 may include one or more dimensions substantially the same as acorresponding dimension of the second portion 448 of the receptacle 403.Turning back to FIGS. 7G-7H, the first portion 466 of the passage 438may include one or more dimensions substantially less than acorresponding dimension of the second portion 448 of the receptacle 403.The taper 464 may narrow the passage 438 such that the second portion468 may be smaller than the first portion 466. For example, the secondportion 468 may include one or more dimensions less than correspondingdimensions of the first portion 466.

As illustrated for example in FIGS. 7E and 7H, in some configurations,the passage 438 of the shuttle 428 may be sized and shaped to correspondwith the size and shape of the chamber 418. Such configurations mayfacilitate directing substances into the chamber 418 via the passage 438of the shuttle 428. Some configurations of the passage 438 with respectto the chamber 418 may permit samples to enter the chamber 418 via thepassage 438 while facilitating minimization of aggregation, segregation,and/or agglomeration in the sample and/or analyte.

Specifically, the second portion 468 of the passage 438 may be sizedand/or shaped to correspond to the chamber 418. In some configurations,the passage 438 may include one or more dimensions corresponding to oneor more dimensions of the chamber 418. For example, the passage 438 maybe sized and shaped to include one or more dimensions less than,substantially the same as, or greater than one or more dimensions of thechamber 418. In some configurations, the passage 438 may include across-sectional area corresponding to a cross-sectional area of thechamber 418. For example, the passage 438 may be sized and shaped toinclude a cross-sectional area less than, substantially the same as, orgreater than a cross-sectional area of the chamber 418. In someconfigurations, the passage 438 may include a volume corresponding to avolume of the chamber 418. For example, the passage 438 may be sized andshaped to include a volume less than, substantially the same as, orgreater than the volume of the chamber 418.

As discussed above, the actuator 422 may drive the shuttle 428 along thedirection of movement S. With attention to FIGS. 7H-7G for example, themovement of the shuttle 428 will be discussed in further detail. Theactuator 422 may drive the shuttle 428 between a first positionillustrated for example in FIG. 7G, and a second position illustratedfor example in FIG. 7H. In the position illustrate in FIG. 7G, thesubstance 450 may not be permitted to travel through the passage 438 andinto the chamber 418 over the window 84 of the interface assembly 80. Inthe position of FIG. 7H, substance 450 may travel through the passage438 and over the window 84 to be analyzed and/or processed. Accordingly,when the shuttle 428 is positioned in the position of FIG. 7H, thepassage 438 permits a portion of substance 450 in the hopper 402 toenter the chamber 418 and when the shuttle 428 is positioned in theposition of FIG. 7G, substance 450 in the hopper 402 does not enter thechamber 418 because the chamber 418 is covered by the body of theshuttle 428. In the first position of the shuttle 428 (see for exampleFIG. 7G), the passage 438 may not be aligned with the chamber 418. Insuch positions, the chamber 418 may be occluded by the shuttle 428 suchthat substance 450 may not travel into the chamber 418. In the secondposition of the shuttle 428 (see for example FIG. 7H), the passage 438may be at least partially aligned with the chamber 418 to permitsubstance 450 to enter the chamber 418. The movement of the shuttle 428may permit granular sample portions such as substance 450 toincrementally enter the chamber 418 to be analyzed. Specifically, therepeated movement of the shuttle 428 may apportion granular samples suchas substance 450 to be analyzed.

As illustrated for example in FIG. 7D, the device 400 may include adetector 430 configured to detect at least one position of the shuttle428. The detector 430 may be part of an interlock mechanism configuredto disable operation of portions of the system 40 when the shuttle 428is in certain positions. For example, the interlock mechanism maydisable emitters such as the emitters 96 of the interface assembly 80and/or the emitter assembly 62 inside of the housing 42. In someconfigurations, the detector 430 may be configured to detect when theshuttle 428 is in the first position to disable operation of portions ofthe system 40 when the shuttle 428 is in the first position.Additionally or alternatively, the detector 430 may be configured todetect when the shuttle 428 is in the second position to enableoperation of portions of the system 40 when the shuttle 428 is in thesecond position. In some configurations, the detector 430 may beconfigured to enable and/or disable the head assembly 70.

In operation, the electronic assembly 420 and/or other portions of thesystem 40 may be configured to actuate the actuator 422 to move theshuttle 428 into a loading position. This may permit the substance toflow out of the passage 438 of the shuttle 428 into the chamber 418 overthe window 84. In the loading position, the detector 430 may beconfigured to break the current to one or more emitters.

Additionally or alternatively, the electronic assembly 420 and/or otherportions of the system 40 may be configured to actuate the actuator 422to move the shuttle 428 into a scanning position. This blocks the flowof the substance into the chamber 418 over the window 84. This mayisolate the substance over the window 84 in the chamber 418. In thescanning position, the detector 430 may be configured to allow currentto flow to one or more emitters. The system 40 may be configured toanalyze and/or process the substance in the second scanning position,for example, with the head assembly 70.

As discussed above, the inlet conduit 412 and the outlet conduit 416 maybe configured to permit gaseous or liquid fluid to pass through the bodyportion 434 to the chamber 418 to evacuate and/or purge the substancefrom the chamber 418 after the substance is analyzed and/or processed.The inlet 410 and/or the outlet 414 may be connected to, for example, avacuum line, a fluid line and/or a gas line to facilitate evacuationand/or purging of the substance.

In some configurations, after the substance is evacuated and/or purgedfrom the chamber 418, the contents of the chamber 418 may be analyzed todetermine whether the substance has been fully or sufficiently evacuatedand/or purged. For example, the head assembly 70 may analyze thecontents of the chamber 418. In some configurations, the substance maybe evacuated via the outlet conduit 416 into a sample container forfurther processing and/or analysis. In other configurations, thesubstance may be evacuated via the outlet conduit 416 and discarded.

Additionally or alternatively, the electronic assembly 420 and/or otherportions of the system 40 may be configured to actuate the actuator 422to move the shuttle 428 back into the loading position. Theabove-mentioned process can be repeated until all of the substancepositioned in the hopper 402 has been analyzed and/or processed. In someconfigurations, the head assembly 70 may be used to determine that nosubstance is left in the hopper 402. In some configurations, the device400 may be operated automatically by the electronic assembly 420 and/orother portions of the system 40. In such configurations, processors ofthe electronic assembly 420 and/or other portions of the system 40 maybe configured to execute instructions such that the device 400 and/orthe system 40 performs any combination or all of the steps describedabove.

The shuttle 428 may include any suitable configurations to apportion thesubstance 450 to be analyzed. For example, in alternative configurationsthe shuttle 428 may include a gate that opens and closes toincrementally permit samples such as the substance 450 to be analyzed.In another example, the shuttle 428 may be a rotating member such as agear with boundary members configured to separate samples into portionsto be analyzed. In such configurations, the boundary members may defineone or more compartments that receive a portion of the samples to beincrementally analyzed. Although in the illustrated configuration theshuttle 428 is actuated in one direction of movement, in otherconfigurations the shuttle 428 may be actuated in any suitable number ofdirections of movement (linear, angular, etc.) to apportion samples tobe incrementally analyzed. In some configurations, only a portion of theshuttle 428, such as a gate or a boundary member, may be actuated toapportion samples. Additionally or alternatively, in some configurationsthe shuttle 428 may be actuated to deliver samples to be analyzed, forexample, over the window 84. In such configurations, the shuttle 428 mayapportions samples to be analyzed, the shuttle 428 may be actuated overthe window 84 and release the sample portions to be analyzed.

With reference to FIGS. 8A-8B, a method 700 of analyzing granularsamples will be described in further detail. In some configurations, themethod 700 may be implemented by the system 40 with the device 400.Although the method 700 will be described with respect to the system 40and the device 400, it should be appreciated that the method 700 may beimplemented in other manners and/or with other embodiments.

As illustrated for example in FIG. 8A, the example method 700 mayinclude a step 710 of providing granular samples to be analyzed. Themethod 700 may include a step 720 of apportioning the granular samplesinto granular sample increments. The method 700 may include a step 730of incrementally analyzing each of the granular sample increments.

Turning to FIG. 8B, the method 700 will be described in further detail.Specifically, an example configuration of the step 730 of the method 700will be described in further detail. As illustrated, the step 730 ofincrementally analyzing each of the granular sample increments mayinclude a step 731 of actuating a shuttle to permit the granular sampleincrement to enter a sample chamber; a step 732 of transmittingelectromagnetic radiation from an emitter to incident the granularsample increment; a step 733 of moving a portion of an analyzationsubassembly in one or more directions of movement with respect to thegranular sample increment to scan at least a portion of the granularsample increment; a step 734 of receiving electromagnetic radiation fromthe granular sample increment by the analyzation subassembly; a step 735of identifying at least one characteristic of a component of thegranular sample increment based on the electromagnetic radiationreceived from the granular sample increment; and/or a step 736 ofevacuating the granular sample increment from the sample chamber. Themethod 700 may include any suitable aspects described above, forexample, with respect to FIGS. 7A-7H.

FIG. 9A illustrates a schematic representation of the device 400 withadditional aspects and/or components illustrated. Specifically, thedevice 400 may include an evacuation subassembly 480. With attention toFIG. 8, additional aspects of the system 40 including the evacuationsubassembly 480 will be discussed. As illustrated, the substance 450 maybe positioned in the hopper 402 which may direct the substance 450 intothe chamber 418 positioned over the interface assembly 80, as describedabove. The inlet conduit 412 and the outlet conduit 416 may be in fluidconnection with the chamber 418 and permit the substance 450 to beevacuated and/or purged from the chamber 418. A vacuum element 452 suchas a compressor, blower, pump, or vacuum may generate a pressuredifferential to evacuate and/or purge the substance 450. The device 400may include a switch 456 configured to selectively couple the vacuum 452to one or more vessels 454 a, 454 b . . . 454 n. The device 400 mayinclude any suitable number of vessels 454 a-454 n. The vessels 454a-454 n may be configured to retain portions of the substance 450evacuated and/or purged from the chamber 418. One or more of the vessels454 a-454 n may include outlets 458 a, 458 b . . . 458 n correspondingto the one or more vessels 454 a, 454 b . . . 454 n. The outlets 458a-458 n may permit portions of the substance 450 in correspondingvessels 454 a-454 n to be continuously or incrementally removed from thevessels 454 a-454 n. One or more of the outlets 458 a-458 n may becoupled to a disposal to permit substance in one or more of the vessels454 a-454 n to be disposed.

As illustrated in FIG. 8, the device 400 may be configured to aggregateand/or concentrate one or more components of the substance 450.Specifically, the switch 456 may be selectively coupled to one of thevessels 454 a-454 n to aggregate and/or concentrate one or morecomponents of the substance 450 in that one of the vessels 454 a-454 n.The switch 456 may be selectively coupled to one of the vessels 454a-454 n based on data from analyzing the substance 450 by the headassembly 70 via the interface assembly 80.

FIGS. 9B-9D illustrate representations of data obtained during analysisof a sample. As illustrated, a portion of the substance 450 may bepositioned on or over the window 84. FIGS. 9B-9D may be visualrepresentations of data obtained during analysis and/or processing ofthe substance 450 by the head assembly 70. Additionally oralternatively, FIGS. 9B-9D may represent visible light images of thesubstance 450 on the window 84. Additionally or alternatively, FIGS.9B-9D may represent data obtained by way of imaging by electromagneticradiation that is different than visible light radiation.

As illustrated in FIG. 9B, the substance 450 may include a plurality ofparticles. In some circumstances, the particles may include differentcharacteristics from one another. For example, the particles may includedifferent dimensions, shapes, chemical composition, etc. Data obtainedduring analysis of the substance 450 may be used to distinguishdifferent particles based on their characteristics. The data may be usedto identify various components of the substance 450. In somecircumstances, the substance 450 may include contaminants that may beidentified based on the data.

FIG. 9C illustrates a representation of the substance 450 with a firstparticle 470. The particle 470 may be any component of the substance450, but in some circumstances the particle 470 may represent acontaminant or a desired component of the substance 450.

FIG. 9D illustrates a representation of the substance 450 with a secondparticle 472. The particle 472 may be any component of the substance450, but in some circumstances the particle 472 may represent acontaminant or a desired component of the substance 450.

Data obtained during analysis of the substance 450 may be used toautomatically or manually identify the particle 470 and/or the particle472. Specifically, the system 40 may be configured to automatically ormanually identify the particle 470 and/or the particle 472.

With collective reference to FIGS. 9A-9D, the operation of the exampledevice 400 configured to aggregate and/or concentrate one or morecomponents of the substance 450 will be described. The system 40 mayanalyze the substance 450 and obtain data regarding the substance 450.The system 40 may automatically determine characteristics of componentsand/or particles of the substance 450.

If the system 40 determines that the substance 450 does not includecomponents and/or contaminants such as particles 470, 472 (asillustrated for example in FIGS. 9C and 9D), the system 40 may beconfigured to activate the switch 456 to couple the vacuum 452 to thevessel 454 a. The vacuum 452 may evacuate the substance 450 from thechamber 418 into the vessel 454 a. If the vessel 454 a is connected tothe outlet 458 a, then the vacuum 452 may be configured to direct thesubstance 450 to the outlet 458 a. If the outlet 458 a is connected to adisposal, the substance 450 may be disposed. Alternatively, thesubstance 450 may be retained in the vessel 454 a. In suchconfigurations, the device 400 may be configured to aggregate and/orconcentrate portions of the substance 450 without components and/orcontaminants such as particles 470, 472 in the vessel 454 a. Forexample, the above-mentioned process may be repeated for multipleportions of the substance 450 to aggregate and/or concentrate multipleportions of the substance 450 that do not include components and/orcontaminants such as particles 470, 472 in the vessel 454 a.

If the system 40 determines that the substance 450 includes one or morecomponents and/or contaminants such as particle 470 (as illustrated forexample in FIG. 9C), the system 40 may be configured to activate theswitch 456 to couple the vacuum 452 to the vessel 454 b. The vacuum 452may evacuate the substance 450 with the particle 470 from the chamber418 into the vessel 454 b. If the vessel 454 b is connected to theoutlet 458 b, then the vacuum 452 may be configured to direct thesubstance 450 with the particle 470 to the outlet 458 b. If the outlet458 b is connected to a disposal, the substance 450 with the particle470 may be disposed. Alternatively, the substance 450 with the particle470 may be retained in the vessel 454 b. In such configurations, thedevice 400 may be configured to aggregate and/or concentrate portions ofthe substance 450 with the particle 470 in the vessel 454 b. Forexample, the above-mentioned process may be repeated for multipleportions of the substance 450 with components and/or contaminants suchas the particle 470 to aggregate and/or concentrate multiple portions ofthe substance 450 that include components and/or contaminants such asthe particle 470 in the vessel 454 b. The aggregated and/or concentratedportions of the substance 450 may be retained for future analysis and/orprocessing.

If the system 40 determines that the substance 450 includes one or morecomponents and/or contaminants such as particle 472 (as illustrated forexample in FIG. 9D), the system 40 may be configured to activate theswitch 456 to couple the vacuum 452 to the vessel 454 n. The vacuum 452may evacuate the substance 450 with the particle 472 from the chamber418 into the vessel 454 n. If the vessel 454 n is connected to theoutlet 458 n, then the vacuum 452 may be configured to direct thesubstance 450 with the particle 472 to the outlet 458 n. If the outlet458 n is connected to a disposal, the substance 450 with the particle472 may be disposed. Alternatively, the substance 450 with the particle472 may be retained in the vessel 454 n. In such configurations, thedevice 400 may be configured to aggregate and/or concentrate portions ofthe substance 450 with the particle 472 in the vessel 454 n. Forexample, the above-mentioned process may be repeated for multipleportions of the substance 450 with components and/or contaminants suchas the particle 472 to aggregate and/or concentrate multiple portions ofthe substance 450 that include components and/or contaminants such asthe particle 472 in the vessel 454 n. The aggregated and/or concentratedportions of the substance 450 may be retained for future analysis and/orprocessing.

With reference to FIGS. 10A-10B, a method 800 of analyzing granularsamples will be described in further detail. In some configurations, themethod 800 may be implemented by the system 40 with the device 400and/or the evacuation assembly 480. It should be appreciated that themethod 800 may be implemented in other manners and/or with otherembodiments.

As illustrated for example in FIG. 10A, the example method 800 mayinclude a step 810 of apportioning the granular samples into granularsample portions including a first granular sample portion. The method800 may include a step 820 of receiving electromagnetic radiation fromthe first granular sample portion. The method 800 may include a step 830of identifying at least one characteristic of at least one component ofthe first granular sample portion based on the electromagnetic radiationreceived from the first granular sample portion. The method 800 mayinclude a step 840 determining whether the first granular portionincludes a component with the first characteristic. The method 800 mayinclude a step 842 of evacuating the first granular sample portion intoa first outlet channel if the first granular sample portion does notinclude the component with the first characteristic. The method 800 mayinclude a step 844 evacuating the first granular sample portion into asecond outlet channel if the first granular sample portion includes thecomponent with the first characteristic.

Turning to FIG. 10B, the method 800 will be described in further detail.Specifically, an example configuration of the method 800 will bedescribed in further detail. As illustrated, in some configurations themethod 800 may proceed to step 850 after the step 840, rather step 842as illustrated for example in FIG. 10A. As illustrated in FIG. 10B, themethod 800 may include the step 850 of determining whether the firstgranular portion includes a component with a second characteristic. Themethod 800 may include the step 854 of evacuating the first granularsample portion into a third outlet channel if the first granular sampleportion includes the component with the second characteristic. If thefirst granular sample portion does not include the component with thesecond characteristic, then the method may proceed to step 860. Asillustrated, the method 800 may continue for any number of components ofany number N of characteristics. Specifically, the method 800 mayinclude step 860 of determining whether the first granular portionincludes a component with n characteristic. The method 800 may includestep 862 of evacuating the first granular sample portion into a firstoutlet channel if the first granular sample portion does not include anycomponents with n characteristics. The method 800 may include step 864of evacuating the first granular sample portion into N outlet channelsif the first granular sample portion includes the component with Ncharacteristic.

The method 800 may be used to concentrate one or more components withcertain characteristics in a specified outlet channel. Additionally oralternatively, the method 800 may be used to filter components withcertain characteristics from a specified outlet channel. The method 800may be used to separate and/or sort portions of an analyzed sample basedon one or more detected characteristics of a component. Additionally oralternatively, the method 800 may be implemented to separate and/or sortportions of an analyzed sample based on one or more characteristics thatare absent from the sample portions. The method 800 may include anysuitable aspects described above, for example, with respect to FIGS.9A-9D.

FIGS. 11A-11D illustrate a sample positioned on the window 84. FIGS.11A-11D may be visual representations of data obtained during analysisand/or processing of a sample by the head assembly 70. Additionally oralternatively, FIGS. 11A-11D may represent visible light images of asample on the window 84. Additionally or alternatively, FIGS. 11A-11Dmay represent data obtained by way of imaging by electromagneticradiation that is different than visible light radiation. With attentionto FIGS. 11A-11D, a method of analyzing and/or processing a sample willbe described in further detail.

As illustrated in FIG. 11A, a sample may include a plurality ofparticles. In some circumstances, the particles may include differentcharacteristics from one another. For example, the particles may includedifferent dimensions, shapes, chemical composition, etc. Data obtainedduring analysis of the sample may be used to distinguish differentparticles based on their characteristics. The data may be used toidentify various components of the sample. In some circumstances, thesample may include contaminants that may be identified based on thedata.

A method of analyzing and/or processing a sample may include scanningthe sample using a first scanning method with a first electromagneticradiation. In some configurations, the first electromagnetic radiationmay be visible light resulting in analyzed data representing an image.FIG. 11A illustrates a representation of a sample with the firstparticle 470 that may be obtained using the first scanning method withthe first electromagnetic radiation. The particle 470 may be anycomponent of a sample, but in some circumstances the particle 470 mayrepresent a contaminant or area of interest of a sample. Using the dataobtained by the first scanning method with the first electromagneticradiation, one or more contaminants and/or areas of interest of a samplemay be identified. Identification may include the position and/or othercharacteristics of the contaminants and/or areas of interest.

After the contaminants and/or areas of interest (e.g., the particle 470,etc.) are identified, a second scanning method with a secondelectromagnetic radiation may be used to analyze and/or process thesample. In some configurations, the second scanning method may be Ramanspectroscopy.

The second scanning method with the second electromagnetic radiation maybe configured based on data obtained by the first scanning method withthe first electromagnetic radiation. For example, as represented in FIG.11B, the second scanning method may be configured such that certainportions of the sample (e.g., the particle 470, etc.) are not scanned.The portions of the sample that are not scanned may correspond withcontaminants and/or areas of interest.

Additionally or alternatively, as represented in FIG. 11C, the secondscanning method may be configured such that only certain portions of thesample (e.g., the particle 470, etc.) are scanned. The portions of thesample that are scanned may correspond with contaminants and/or areas ofinterest. The second scanning method may alter and/or modulate thecharacteristics of the sample. For example, the second electromagneticradiation may burn or otherwise alter contaminants such as the particle470.

Additionally or alternatively, as represented in FIG. 11D, the secondscanning method may be configured such that certain portions of thesample (e.g., the particle 470, etc.) are scanned with electromagneticradiation with different characteristics.

In some configurations, a method of analyzing and/or processing a samplemay include imaging a sample with electromagnetic radiation such asvisible light and/or ultraviolet light. The method of analyzing and/orprocessing the sample may include analyzing the sample with Ramanspectroscopy after imaging the sample. The method of analyzing and/orprocessing the sample may include configuring the Raman spectroscopyanalyzation after imaging the sample and/or before Raman spectroscopyanalyzation. Configuring the Raman spectroscopy analyzation may includeidentifying contaminants and/or areas of interest based on data obtainedfrom imaging the sample. Configuring the Raman spectroscopy analyzationmay include selecting portions of the sample to be analyzed by Ramanspectroscopy and/or selecting portions of the sample not to be analyzedby Raman spectroscopy. Configuring the Raman spectroscopy analyzationmay include selecting first portions of the sample to be analyzed byRaman spectroscopy of a first characteristic (e.g., power level,resolution, etc.) and/or selecting second portions of the sampledifferent than the first portions to be analyzed by Raman spectroscopyof a second characteristic (e.g., power level, resolution, etc.). Themethod of analyzing and/or processing the sample may include analyzingthe sample with Raman spectroscopy based on the configuration of theRaman spectroscopy analyzation.

With reference to FIG. 12, a method 900 method of analyzing and/orprocessing a sample will be described in further detail. In someconfigurations, the method 900 may be implemented by the system 40. Itshould be appreciated that the method 900 may be implemented in othermanners and/or with other embodiments. As illustrated for example inFIG. 12, the example method 900 may include a step 910 of scanning thesample using a first scanning method with a first electromagneticradiation. The method 900 may include a step 920 of identifying one ormore contaminants and/or areas of interest of a sample. The method 900may include a step 930 of scanning the sample using a second scanningmethod with a second electromagnetic radiation based on the position ofthe contaminants and/or areas of interest. The method 900 may includeany suitable aspects described above.

Aspects of the present disclosure may be embodied in other forms withoutdeparting from its spirit or characteristics. The described aspects areto be considered in all respects illustrative and not restrictive. Allchanges which come within the meaning and range of equivalency of theclaims are to be embraced within their scope.

What is claimed is:
 1. A device for apportioning granular samplescomprising: a sample feeder defining a conduit, the conduit including afirst opening to receive the granular samples and a second opening; ashuttle operably coupled to the sample feeder to receive the granularsamples from the conduit via the second opening, the shuttle configuredto apportion the granular samples to incrementally enter a samplechamber to be analyzed; and an outlet conduit fluidly coupled to thesample chamber and configured to permit the sample chamber to beevacuated.
 2. The device of claim 1, further comprising an actuationsubassembly configured to actuate the shuttle in one or more directionsof movement, the actuation subassembly comprising: a first actuatorconfigured to actuate the shuttle in a first direction of movementbetween a first position and a second position; and a first slideconfigured to permit the shuttle to be moved between the first positionand the second position; wherein the shuttle positioned in the firstposition does not permit the granular sample portions to enter thesample chamber, and the shuttle positioned in the second positionpermits at least one of the granular sample portions to enter the samplechamber.
 3. The device of claim 2, wherein the shuttle at leastpartially defines a shuttle passage sized and shaped to correspond withthe size and shape of the sample chamber.
 4. The device of claim 3,wherein the shuttle passage extends at least partially through theshuttle.
 5. The device of claim 1, wherein the shuttle comprises thesample chamber.
 6. The device of claim 1, wherein the sample chambercomprises an electromagnetically transmissive window.
 7. The device ofclaim 1, further comprising an evacuation subassembly fluidly coupled tothe outlet conduit and to the sample chamber, wherein the evacuationsubassembly comprises: one or more vacuum elements configured togenerate a pressure differential to evacuate the sample chamber; and aswitch configured to selectively couple the one or more vacuums to oneor more outlet channels to selectively evacuate the sample chamber intoone or more outlet channels; wherein the sample chamber is selectivelyevacuated based on one or more characteristics of at least one componentof a substance detected or not detected inside of the sample chamber. 8.The device of claim 1, further comprising an evacuation subassemblyfluidly coupled to the outlet conduit and to the sample chamber,wherein, the granular sample comprises one or more granular sampleportions; and the evacuation subassembly comprises: one or more vacuumelements configured to generate a pressure differential to evacuate thesample chamber fluidly coupled to the one or more vacuum elements; and aswitch configured to selectively couple the one or more vacuums to oneor more outlet channels to selectively evacuate the one or more granularsample portions into the one or more outlet channels.
 9. The device ofclaim 8, wherein each of the one or more granular sample portions isevacuated based on at least one characteristic of a component of the oneor more granular sample portions.
 10. The device of claim 8, wherein theevacuation subassembly comprises a filter configured to separate solidsubstance from gaseous or liquid fluid in the one or more outletchannels.
 11. The device of claim 1, further comprising a hopper coupledto the sample feeder and configured to direct the granular samples intothe sample feeder.
 12. A method of analyzing granular samplescomprising: providing the device of claim 1; providing granular samplesto be analyzed to the conduit of the sample feeder; apportioning thegranular samples into granular sample increments; and incrementallyanalyzing each of the granular sample increments, comprising, for eachgranular sample increment: actuating the shuttle to permit a granularsample increment to enter the sample chamber at least partially definedby an electromagnetically transmissive window; transmittingelectromagnetic radiation from an emitter to the granular sampleincrement; moving a portion of an analyzation subassembly in one or moredirections of movement with respect to the granular sample increment toscan at least a portion of the granular sample increment; receivingelectromagnetic radiation from the granular sample increment by one ormore sensors through the electromagnetically transmissive window;identifying at least one characteristic of a component of the granularsample increment based on the received electromagnetic radiation; andevacuating the granular sample increment from the sample chamber. 13.The method of claim 12, wherein receiving the electromagnetic radiationcomprises, receiving the electromagnetic radiation from the granularsample increment at a sensor of the one or more sensors, wherein thesensor is configured to generate signals based on the receivedelectromagnetic radiation.
 14. The method of claim 13, furthercomprising analyzing the signals to generate a representation of atleast a portion of the granular sample increment.
 15. The method ofclaim 14, further comprising identifying at least one component of thegranular sample increment based on the signals.
 16. The method of claim12, wherein the granular samples comprise pharmaceuticalmicro-structured blends of substances.